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feature and applications ul e223037 ? rohs compliant & halogen free ? excellent for high density applications ? surface mount, 0805, 1206, 1210, 1812, 2920 ? faster time to trip than standard smd devices ? lower resistance than standard smd devices ? operation current: 0.05a ~ 3.0a ? maximum voltage: 6v ~ 60v ? temperature range: -40oc to 85oc mpts 0805 l 10 r meritek series size 0805 1206 1210 1812 2920 current rating semi-circular termination polymeric ptc mpts series r e v . 7
electrical characteristics (23oc) mpts0805 part number hold current trip current rated voltage max current typical power max time to trip resistance current time r min r1 max i h , a i t , a v max , vdc i max , a pd, w amp sec ? ? mpts0805l010r 0.10 0.30 15 100 0.5 0.50 1.50 0.700 6.000 MPTS0805L020R 0.20 0.50 9 100 0.5 8.00 0.02 0.400 3.500 mpts0805l035r 0.35 0.75 6 100 0.5 8.00 0.10 0.250 1.200 mpts0805l050r 0.50 1.00 6 100 0.5 8.00 0.10 0.150 0.850 mpts0805l075r 0.75 1.50 6 40 0.6 8.00 0.20 0.090 0.350 mpts0805l100r 1.00 1.95 6 40 0.6 8.00 0.30 0.060 0.210 i h =hold current-maximum current at which t he device will not trip at 23oc still air. i t =trip current-minimum current at which the device will always trip at 23oc still air. v max =maximum voltage device can withstand without damage at its rated current (i max ) i max = maximum fault current device can withstand without damage at rated voltage (v max ). p d =typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23oc still air environment. r min =minimum device resistance at 23oc prior to tripping. r1 max =maximum device resistance at 23oc me asured 1 hour after tripping or reflow soldering of 260oc for 20 seconds. termination pad characteristics termination pad materials: pure tin product dimensions (millimeters) mpts0805 part number a b c d e min max min max min max min max min max mpts0805l010r 2.00 2.30 1.20 1.50 0.55 1.00 0.20 0.60 0.10 0.45 MPTS0805L020R 2.00 2.30 1.20 1.50 0.55 1.00 0.20 0.60 0.10 0.45 mpts0805l035r 2.00 2.30 1.20 1.50 0.45 0.75 0.20 0.60 0.10 0.45 mpts0805l050r 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45 mpts0805l075r 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45 mpts0805l100r 2.00 2.30 1.20 1.50 0.75 1.80 0.20 0.60 0.10 0.45 polymeric ptc mpts series r e v . 7
thermal derating curve typical time-to-trip at 23oc polymeric ptc mpts series a =mpts0805l010r b =MPTS0805L020R c =mpts0805l035r d =mpts0805l050r e =mpts0805l075r f =mpts0805l100r a b c d e f 0.01 0.1 1 10 100 0.1 1 10 fault current (a) time-to-tr ip (s ) r e v . 7
the dimension in the table below provides t he recommended pad layout for each mpts0805 device profile feature pb-free assembly average ramp-up rate (tsmax to tp) 3 /second max. preheat : temperature min (tsmin) temperature max (tsmax) time (tsmin to tsmax) 150 200 60-180 seconds time maintained above: temperature(t l ) time (t l ) 217 60-150 seconds peak/classification temperature(tp) : 260 time within 5 of actual peak : temperature (tp) 20-40 seconds ramp-down rate : 6 /second max. time 25 to peak temperature : 8 minutes max. polymeric ptc mpts series pad dimensions (millimeters) device a nominal b nominal c nominal all 0805 series 1.20 1.00 1.50 solder reflow x due to ?lead free? nature, temperature and dwell time for the soldering zone is higher than those for non-compliant parts. this may cause damage to other components. x recommended max solder paste thickness > 0.25mm. x devices can be cleaned using standard methods and aqueous solvent. x rework should utilize standard industry practices. theses changes should apply to all notes for each case size. x storage environment : < 30 o c / 60%rh caution: x if reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. x devices are not designed to be wave soldered to the bottom side of the board. r e v . 7
electrical characteristics (23o) mpts1206 part number hold current trip current rated voltage max current typical power max time to trip resistance current time r min r1 max i h , a i t , a v max , vdc i max , a pd, w amp sec ? ? mpts1206l005r 0.05 0.15 60 10 0.4 0.25 1.50 3.60 50.00 mpts1206l010r 0.10 0.25 60 10 0.4 0.50 1.00 1.60 15.00 mpts1206l012r 0.12 0.39 48 10 0.6 1.00 0.20 1.40 6.50 mpts1206l016r 0.16 0.45 48 10 0.6 1.00 0.30 1.10 5.00 mpts1206l020r 0.20 0.40 30 10 0.4 8.00 0.10 0.600 2.500 mpts1206l025r 0.25 0.50 16 40 0.6 8.00 0.08 0.550 2.300 mpts1206l035r 0.35 0.75 16 40 0.4 8.00 0.10 0.300 1.200 mpts1206l050r 0.50 1.00 8 40 0.4 8.00 0.10 0.150 0.700 mpts1206l050-24r 0.50 1.00 24 100 0.6 8.00 0.10 0.150 0.750 mpts1206l075r 0.75 1.50 6 100 0.6 8.00 0.20 0.090 0.290 mpts1206l075-16r 0.75 1.50 16 100 0.6 8.00 0.20 0.090 0.290 mpts1206l100r 1.00 1.80 6 100 0.6 8.00 0.30 0.055 0.210 mpts1206l110r 1.10 2.20 6 100 0.8 8.00 0.30 0.040 0.180 mpts1206l150r 1.50 3.00 6 100 0.8 8.00 1.00 0.030 0.120 mpts1206l200r 2.00 3.50 6 100 0.8 8.00 1.50 0.018 0.080 i h =hold current-maximum current at which t he device will not trip at 23oc still air. i t =trip current-minimum current at which the device will always trip at 23oc still air. v max =maximum voltage device can withstand without damage at its rated current (i max ) i max = maximum fault current device can withstand without damage at rated voltage (v max ). pd=typical power dissipated-type amount of power dissipated by t he device when in the tripp ed state in 23oc still air environment. r min =minimum device resistance at 23oc prior to tripping. r1 max =maximum device resistance at 23oc me asured 1 hour after tripping or reflow soldering of 260oc for 20 seconds. termination pad characteristics termination pad materials: pure tin polymeric ptc mpts series r e v . 7
product dimensions (millimeters) mpts1206 part number a b c d e min max min max min max min max min max mpts1206l005r 3.00 3.50 1.50 1.80 0.45 0.85 0.10 0.75 0.10 0.45 mpts1206l010r 3.00 3.50 1.50 1.80 0.45 0.85 0.10 0.75 0.10 0.45 mpts1206l012r 3.00 3.50 1.50 1.80 0.45 0.85 0.10 0.75 0.10 0.45 mpts1206l016r 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45 mpts1206l020r 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45 mpts1206l025r 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45 mpts1206l035r 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45 mpts1206l050r 3.00 3.50 1.50 1.80 0.25 0.55 0.10 0.75 0.10 0.45 mpts1206l050-24r 3.00 3.50 1.50 1.80 0.90 1.30 0.25 0.75 0.10 0.45 mpts1206l075r 3.00 3.50 1.50 1.80 0.45 1.25 0.25 0.75 0.10 0.45 mpts1206l075-16r 3.00 3.50 1.50 1.80 0.45 1.25 0.25 0.75 0.10 0.45 mpts1206l100r 3.00 3.50 1.50 1.80 0.45 1.00 0.25 0.75 0.10 0.45 mpts1206l110r 3.00 3.50 1.50 1.80 0.45 1.00 0.25 0.75 0.10 0.45 mpts1206l150r 3.00 3.50 1.50 1.80 0.80 1.40 0.25 0.75 0.10 0.45 mpts1206l200r 3.00 3.50 1.50 1.80 0.85 1.60 0.25 0.75 0.10 0.45 mpts series polymeric ptc r e v . 7
thermal derating curve typical time-to-trip at 23o polymeric ptc mpts series z= mpts1206l005r a= mpts1206l010r b= mpts1206l012r c= mpts1206l016r d= mpts1206l020r e= mpts1206l025r f= mpts1206l035r g= mpts1206l050r mpts1206l050-24r h= mpts1206l075r mpts1206l075-16r i= mpts1206l100r j= mpts1206l110r k= mpts1206l150r l= mpts1206l200r a b c d e f g h i j k l 0.01 0.1 1 10 100 0.1 1 10 100 fault current (a) time-to-trip (s) r e v . 7
the dimension in the table below provides t he recommended pad layout for each mpts1206 device profile feature pb-free assembly average ramp-up rate (tsmax to tp) 3 /second max. preheat : temperature min (tsmin) temperature max (tsmax) time (tsmin to tsmax) 150 200 60-180 seconds time maintained above: temperature(t l ) time (t l ) 217 60-150 seconds peak/classification temperature(tp) : 260 time within 5 of actual peak : temperature (tp) 20-40 seconds ramp-down rate : 6 /second max. time 25 to peak temperature : 8 minutes max. polymeric ptc mpts series pad dimensions (millimeters) device a nominal b nominal c nominal all 1206 series 2.00 1.00 1.90 solder reflow x due to ?lead free? nature, temperature and dwell time for the soldering zone is higher than those for non-compliant parts. this may cause damage together components. x recommended max solder paste thickness > 0.25mm. x devices can be cleaned using standard methods and aqueous solvent. x rework should utilize standard industry practices. theses changes should apply to all notes for each case size. x storage environment : < 30 o c / 60%rh caution: x if reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. x devices are not designed to be wave soldered to the bottom side of the board. r e v . 7
electrical characteristics (23o) mpts1210 part number hold current trip current rated voltage max current typical power max time to trip resistance current time r min r1 max i h , a i t , a v max , vdc i max , a pd, w amp sec ? ? mpts1210l005r 0.05 0.15 60 10 0.60 0.25 3.00 3.600 50.000 mpts1210l010r 0.10 0.25 60 10 0.60 0.50 1.50 1.600 15.000 mpts1210l020r 0.20 0.40 30 10 0.60 8.00 0.02 0.800 5.000 mpts1210l035r 0.35 0.70 16 40 0.60 8.00 0.20 0.320 1.300 mpts1210l050r 0.50 1.00 16 40 0.60 8.00 0.10 0.250 0.900 mpts1210l075r 0.75 1.50 8 40 0.60 8.00 0.10 0.130 0.400 mpts1210l110r 1.10 2.20 6 100 0.80 8.00 0.30 0.060 0.210 mpts1210l150r 1.50 3.00 6 100 0.80 8.00 0.50 0.040 0.110 mpts1210l175r 1.75 4.00 6 100 0.80 8.00 0.60 0.020 0.080 mpts1210l200r 2.00 4.00 6 100 0.80 8.00 1.00 0.015 0.070 i h =hold current-maximum current at which t he device will not trip at 23oc still air. i t =trip current-minimum current at which the device will always trip at 23oc still air. v max =maximum voltage device can withstand without damage at its rated current (i max ) i max = maximum fault current device can withstand without damage at rated voltage (v max ). pd=typical power dissipated-type amount of power dissipated by t he device when in the tripp ed state in 23oc still air environment. r min =minimum device resistance at 23oc prior to tripping. r1 max =maximum device resistance at 23oc me asured 1 hour after tripping or reflow soldering of 260oc for 20 seconds. termination pad characteristics termination pad materials: pure tin mpts series polymeric ptc r e v . 7
product dimensions (millimeters) mpts1210 part number a b c d e min max min max min max min max min max mpts1210l005r 3.00 3.43 2.35 2.80 0.60 1.15 0.25 0.75 0.10 0.45 mpts1210l010r 3.00 3.43 2.35 2.80 0.60 1.15 0.25 0.75 0.10 0.45 mpts1210l020r 3.00 3.43 2.35 2.80 0.40 0.85 0.25 0.75 0.10 0.45 mpts1210l035r 3.00 3.43 2.35 2.80 0.40 0.80 0.25 0.75 0.10 0.45 mpts1210l050r 3.00 3.43 2.35 2.80 0.30 0.75 0.25 0.75 0.10 0.45 mpts1210l075r 3.00 3.43 2.35 2.80 0.30 0.70 0.25 0.75 0.10 0.45 mpts1210l110r 3.00 3.43 2.35 2.80 0.60 1.00 0.25 0.75 0.10 0.45 mpts1210l150r 3.00 3.43 2.35 2.80 0.50 0.90 0.25 0.75 0.10 0.45 mpts1210l175r 3.00 3.43 2.35 2.80 0.80 1.40 0.25 0.75 0.10 0.45 mpts1210l200r 3.00 3.43 2.35 2.80 0.80 1.40 0.25 0.75 0.10 0.45 polymeric ptc mpts series r e v . 7
thermal derating curve typical time-to-trip at 23oc mpts series polymeric ptc a =mpts1210l005r b =mpts1210l010r c =mpts1210l020r d =mpts1210l035r e =mpts1210l050r f =mpts1210l075r g =mpts1210l110r h =mpts1210l150r i= mpts1210l175r j =mpts1210l200r b c d e f g h i j 0.001 0.01 0.1 1 10 100 0.1 1 10 100 fault current (a) time-to-trip (s) r e v . 7
the dimension in the table below provides t he recommended pad layout for each mpts1210 device profile feature pb-free assembly average ramp-up rate (tsmax to tp) 3 /second max. preheat : temperature min (tsmin) temperature max (tsmax) time (tsmin to tsmax) 150 200 60-180 seconds time maintained above: temperature(t l ) time (t l ) 217 60-150 seconds peak/classification temperature(tp) : 260 time within 5 of actual peak : temperature (tp) 20-40 seconds ramp-down rate : 6 /second max. time 25 to peak temperature : 8 minutes max. polymeric ptc mpts series solder reflow x due to ?lead free? nature, temperature and dwell time for the soldering zone is higher than those for non-compliant parts. this may cause damage to other components. x recommended max solder paste thickness > 0.25mm. x devices can be cleaned using standard methods and aqueous solvent. x rework should utilize standard industry practices. theses changes should apply to all notes for each case size. x storage environment : < 30 o c / 60%rh caution: x if reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. x devices are not designed to be wave soldered to the bottom side of the board. pad dimensions (millimeters) device a nominal b nominal c nominal all 1210 series 2.00 1.00 2.80 r e v . 7
electrical characteristics (23o) mpts1812 i h =hold current-maximum current at which t he device will not trip at 23oc still air. i t =trip current-minimum current at which the device will always trip at 23oc still air. v max =maximum voltage device can withstand without damage at its rated current (i max ) i max = maximum fault current device can withstand without damage at rated voltage (v max ). pd=typical power dissipated-type amount of power dissipated by t he device when in the tripp ed state in 23oc still air environment. r min =minimum device resistance at 23oc prior to tripping. r1 max =maximum device resistance at 23oc me asured 1 hour after tripping or reflow soldering of 260oc for 20 seconds. termination pad characteristics termination pad materials: pure tin part number hold current trip current rated voltage max current typical power max time to trip resistance current time r min r1 max i h , a i t , a v max , vdc i max , a pd, w amp sec ? ? mpts1812l010r 0.10 0.30 60 10 0.8 8.0 0.020 1.600 15.00 mpts1812l014r 0.14 0.30 60 10 0.8 8.0 0.008 1.200 6.500 mpts1812l020r 0.20 0.40 30 10 0.8 8.0 0.020 0.800 5.000 mpts1812l035r 0.35 0.70 16 40 0.8 8.0 0.100 0.320 1.500 mpts1812l050r 0.50 1.00 16 40 0.8 8.0 0.150 0.150 1.000 mpts1812l075r 0.75 1.50 16 40 0.8 8.0 0.200 0.110 0.450 mpts1812l075-24r 0.75 1.50 24 40 1.0 8.0 0.200 0.110 0.290 mpts1812l075-33r 0.75 1.50 33 40 1.0 8.0 0.200 0.110 0.400 mpts1812l110r 1.10 2.20 8 100 0.8 8.0 0.300 0.040 0.210 mpts1812l110-16r 1.10 2.20 16 100 0.8 8.0 0.500 0.040 0.180 mpts1812l110-24r 1.10 2.20 24 100 1.0 8.0 0.500 0.060 0.200 mpts1812l125r 1.25 2.50 6 40 0.8 8.0 0.400 0.050 0.140 mpts1812l150r 1.50 3.00 8 100 0.8 8.0 0.500 0.040 0.110 mpts1812l150-12r 1.50 3.00 12 100 1.0 8.0 0.500 0.040 0.110 mpts1812l150-24r 1.50 3.00 24 100 1.0 8.0 1.500 0.040 0.120 mpts1812l160r 1.60 3.20 8 100 0.8 8.0 0.500 0.030 0.100 mpts1812l160-12r 1.60 3.20 12 100 1.0 8.0 1.000 0.030 0.100 mpts1812l160-16r 1.60 3.20 16 100 1.0 8.0 1.000 0.030 0.100 mpts1812l200r 2.00 3.50 8 100 1.0 8.0 2.000 0.020 0.070 mpts1812l260r 2.60 5.00 6 100 1.0 8.0 2.500 0.015 0.047 mpts1812l260-13r 2.60 5.00 13.2 100 1.3 8.0 5.000 0.015 0.050 mpts1812l260-16r 2.60 5.00 16 100 1.3 8.0 5.000 0.015 0.050 mpts1812l300r 3.00 5.00 6 100 1.0 8.0 4.000 0.012 0.040 mpts series polymeric ptc r e v . 7
product dimensions (millimeters) mpts1812 part number a b c d e min max min max min max min max min max mpts1812l010r 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65 mpts1812l014r 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65 mpts1812l020r 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65 mpts1812l035r 4.37 4.73 3.07 3.41 0.40 0.70 0.30 0.95 0.25 0.65 mpts1812l050r 4.37 4.73 3.07 3.41 0.35 0.65 0.30 0.95 0.25 0.65 mpts1812l075r 4.37 4.73 3.07 3.41 0.35 0.65 0.30 0.95 0.25 0.65 mpts1812l075-24r 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 mpts1812l075-33r 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 mpts1812l110r 4.37 4.73 3.07 3.41 0.25 0.55 0.30 0.95 0.25 0.65 mpts1812l110-16r 4.37 4.73 3.07 3.41 0.25 0.90 0.30 0.95 0.25 0.65 mpts1812l110-24r 4.37 4.73 3.07 3.41 0.80 1.30 0.25 0.95 0.25 0.65 mpts1812l125r 4.37 4.73 3.07 3.41 0.25 0.55 0.30 0.95 0.25 0.65 mpts1812l150r 4.37 4.73 3.07 3.41 0.25 0.55 0.30 0.95 0.25 0.65 mpts1812l150-12r 4.37 4.73 3.07 3.41 0.60 1.10 0.25 0.95 0.25 0.65 mpts1812l150-24r 4.37 4.73 3.07 3.41 0.60 1.55 0.25 0.95 0.25 0.65 mpts1812l160r 4.37 4.73 3.07 3.41 0.25 0.90 0.30 0.95 0.25 0.65 mpts1812l160-12r 4.37 4.73 3.07 3.41 0.60 1.35 0.25 0.95 0.25 0.65 mpts1812l160-16r 4.37 4.73 3.07 3.41 0.60 1.35 0.25 0.95 0.25 0.65 mpts1812l200r 4.37 4.73 3.07 3.41 0.55 1.20 0.25 0.95 0.25 0.65 mpts1812l260r 4.37 4.73 3.07 3.41 0.55 1.20 0.25 0.95 0.25 0.65 mpts1812l260-13r 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 mpts1812l260-16r 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 mpts1812l300r 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 mpts series polymeric ptc r e v . 7
thermal derating curve typical time-to-trip at 23oc polymeric ptc mpts series a = mpts1812l010r b = mpts1812l014r c = mpts1812l020r d = mpts1812l035r e = mpts1812l050r f = mpts1812l075r mpts1812l075-24r mpts1812l075-33r g = mpts1812l110r mpts1812l110-16r mpts1812l110-24r h = mpts1812l125r i = mpts1812l150r mpts1812l150-12r mpts1812l150-24r j = mpts1812l160r mpts1812l160-12r mpts1812l160-16r k = mpts1812l200r l = mpts1812l260r mpts1812l260-13r mpts1812l260-16r m = mpts1812l300r 0. 001 0.01 0.1 1 10 100 0.1 1 10 100 fault current (a) time-to-trip (s) a b c d e f ghi j kl m ---- mpts1812l010r mpts1812l014r mpts1812l020r mpts1812l035r mpts1812l050r mpts1812l075r mpts1812l075-24r mpts1812l075-33r mpts1812l110r mpts1812l110-16r mpts1812l110-24r mpts1812l125r mpts1812l150r mpts1812l150-12r mpts1812l150-24r mpts1812l160r mpts1812l160-12r mpts1812l160-16r mpts1812l200r mpts1812l260r mpts1812l260-13r mpts1812l260-16r mpts1812l300r r e v . 7
the dimension in the table below provides t he recommended pad layout for each mpts1812 device profile feature pb-free assembly average ramp-up rate (tsmax to tp) 3 /second max. preheat : temperature min (tsmin) temperature max (tsmax) time (tsmin to tsmax) 150 200 60-180 seconds time maintained above: temperature(t l ) time (t l ) 217 60-150 seconds peak/classification temperature(tp) : 260 time within 5 of actual peak : temperature (tp) 20-40 seconds ramp-down rate : 6 /second max. time 25 to peak temperature : 8 minutes max. polymeric ptc mpts series pad dimensions (millimeters) device a nominal b nominal c nominal all 1812 series 3.45 1.78 3.50 solder reflow x due to ?lead free? nature, temperature and dwell time for the soldering zone is higher than those for non-compliant parts. this may cause damage to other components. x recommended max solder paste thickness > 0.25mm. x devices can be cleaned using standard methods and aqueous solvent. x rework should utilize standard industry practices. theses changes should apply to all notes for each case size. x storage environment : < 30 o c / 60%rh caution: x if reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. x devices are not designed to be wave soldered to the bottom side of the board. r e v . 7
electrical characteristics (23oc) mpts2920 part number hold current trip current rated voltage max current typical power max time to trip resistance current time r min r1 max i h , a i t , a v max ,vdc i max , a pd, w a sec ? ? mpts2920l030r 0.30 0.60 60 10 1.5 1.5 3.0 1.000 4.800 mpts2920l050r 0.50 1.00 60 10 1.5 2.5 4.0 0.300 1.400 mpts2920l075r 0.75 1.50 33 40 1.5 8.0 0.3 0.180 1.000 mpts2920l100r 1.10 2.20 33 40 1.5 8.0 0.5 0.090 0.410 mpts2920l125r 1.25 2.50 33 40 1.5 8.0 2.0 0.050 0.250 mpts2920l150r 1.50 3.00 33 40 1.5 8.0 2.0 0.050 0.230 mpts2920l185r 1.85 3.70 33 40 1.5 8.0 2.5 0.040 0.150 mpts2920l200r 2.00 4.00 16 40 1.5 8.0 4.5 0.035 0.120 mpts2920l250r 2.50 5.00 16 40 1.5 8.0 16.0 0.025 0.085 mpts2920l260r 2.60 5.20 6 40 1.5 8.0 20.0 0.020 0.075 mpts2920l300r 3.00 5.20 6 40 1.5 8.0 25.0 0.010 0.048 i h =hold current-maximum current at which t he device will not trip at 23oc still air. i t =trip current-minimum current at which the device will always trip at 23oc still air. v max =maximum voltage device can withstand without damage at its rated current (i max ) i max = maximum fault current device can withstand without damage at rated voltage (v max ). pd=typical power dissipated-type amount of power dissipated by t he device when in the tripp ed state in 23oc still air environment. r min =minimum device resistance at 23oc prior to tripping. r1 max =maximum device resistance at 23oc me asured 1 hour after tripping or reflow soldering of 260oc for 20 seconds. termination pad characteristics termination pad materials: pure tin mpts series polymeric ptc r e v . 7
product dimensions (millimeters) mpts2920 part number a b c d e min max min max min max min max min max mpts2920l030r 6.73 7.98 4.80 5.44 0.60 1.15 0.50 1.20 0.50 0.90 mpts2920l050r 6.73 7.98 4.80 5.44 0.60 1.15 0.50 1.20 0.50 0.90 mpts2920l075r 6.73 7.98 4.80 5.44 0.40 1.15 0.50 1.20 0.50 0.90 mpts2920l100r 6.73 7.98 4.80 5.44 0.40 1.00 0.50 1.20 0.50 0.90 mpts2920l125r 6.73 7.98 4.80 5.44 0.40 0.90 0.50 1.20 0.50 0.90 mpts2920l150r 6.73 7.98 4.80 5.44 0.40 0.90 0.50 1.20 0.50 0.90 mpts2920l185r 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90 mpts2920l200r 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90 mpts2920l250r 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90 mpts2920l260r 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90 mpts2920l300r 6.73 7.98 4.80 5.44 0.40 0.90 0.50 1.20 0.50 0.90 polymeric ptc mpts series r e v . 7
thermal derating curve typical time-to-trip at 23oc polymeric ptc mpts series a = mpts2920l030r b = mpts2920l050r c = mpts2920l075r d = mpts2920l100r e = mpts2920l125r f = mpts2920l150r g = mpts2920l185r h = mpts2920l200r i = mpts2920l250r j = mpts2920l260r k= mpts2920l300r a b c d efghijk 0.001 0.01 0.1 1 10 100 0.1 1 10 100 fault current (a) time-to-trip (s) ---- mpts2920l030r mpts2920l050r mpts2920l075r mpts2920l100r mpts2920l125r mpts2920l150r mpts2920l185r mpts2920l200r mpts2920l250r mpts2920l260r mpts2920l300r r e v . 7
the dimension in the table below provides t he recommended pad layout for each mpts2920 device profile feature pb-free assembly average ramp-up rate (tsmax to tp) 3 /second max. preheat : temperature min (tsmin) temperature max (tsmax) time (tsmin to tsmax) 150 200 60-180 seconds time maintained above: temperature(t l ) time (t l ) 217 60-150 seconds peak/classification temperature(tp) : 260 time within 5 of actual peak : temperature (tp) 20-40 seconds ramp-down rate : 6 /second max. time 25 to peak temperature : 8 minutes max. polymeric ptc mpts series pad dimensions (millimeters) device a nominal b nominal c nominal a ll 2920 series 5.10 2.30 5.60 solder reflow x due to ?lead free? nature, temperature and dwell time for the soldering zone is higher than those for non-compliant parts. this may cause damage to other components. x recommended max solder paste thickness > 0.25mm. x devices can be cleaned using standard methods and aqueous solvent. x rework should utilize standard industry practices. theses changes should apply to all notes for each case size. x storage environment : < 30 o c / 60%rh caution: x if reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. x devices are not designed to be wave soldered to the bottom side of the board. r e v . 7

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